Gopel SPI Line – 3D

The ultimate choice for a fast moving generation

Fast Inspection of Solder and Sinter Pastes with SPI Line · 3D

SPI Line · 3D

SPI Line · 3D

The inline inspection system for printed solder paste is characterized by a wide measuring range. Conventional solder pastes with a height of 80 μm to 150 μm can be measured just as well as sinter pastes with a height of only 20 μm. The system is available in various resolution configurations.

The solder paste depots are inspected according to the criteria of shape, height, area, bridges, volume, x/y offset and coplanarity.

The sinter paste inspection also includes the detection of particles, notches, holes and frayings in the depot.